Xi’an ESWIN Materials Technology Co Ltd is engaged in Research & Development, production and sales of 12-inch silicon wafers. Its products include: polishing pads; and epitaxial wafer.
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As of July 19, 2026, ESWIN has market cap of $23B and EV of $23B.
ESWIN has a P/E ratio of (213.0x).
Last FY
2023
2024
2025
2026
2027
2028
EV/Revenue
60.0x
107.8x
74.9x
60.0x
EV/EBITDA
n/m
n/m
n/m
n/m
EV/EBIT
n/m
n/m
n/m
n/m
EV/Gross Profit
n/m
n/m
n/m
n/m
P/E
(213.0x)
n/m
(213.2x)
(213.0x)
EV/FCF
(86.2x)
(46.4x)
(124.5x)
(86.2x)
Multiples above and below 250x are considered non-meaningful (n/m). Valuation data powered by FactSet, Inc. and Morningstar, Inc.
Verified ESWIN Valuation Multiples
Access all public comps and forward-looking valuation multiples like EV/Revenue in 2027, based on consensus analyst estimates. Powered by FactSet and Morningstar.
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Before going public, ESWIN raised $2.5B in total equity funding, across 6 rounds.
Last private valuation of ESWIN was $2.9B, after raising $329M in May 2023 from Phase II Fund.
ESWIN Funding Rounds
Date
Stage
Investors
Raised
Valuation
Rev. Multiple
Deal Summary
Jun-23
Series D
Beijing Fi…+8Beijing Financial Street Capital Operation Center; Beijing E-town International Investment & Development; JIC Investment; Guoxin Zhuoyue Venture Capital; Sino-Singapore Capital; Lanpu Venture; GF Qianhe Investment; Haiyuan Capital; Chengdu High-tech Ceyuan Capital
$419M
-
ESWIN Computing completed a Series D financing round exceeding 3 billion yuan (a…ESWIN Computing completed a Series D financing round exceeding 3 billion yuan (approximately $418.9-421.86 million) in June 2023, with investors including Beijing Financial Street Capital Operation Center and Guoxin Zhuoyue Venture Capital as leads, alongside Beijing E-town International Investment & Development, Chengdu High-tech Ceyuan Capital, GF Qianhe Investment, Haiyuan Capital, JIC Investment, Lanpu Venture, and Sino-Singapore Capital. The company, led by Wang Dongsheng, focuses on RISC-V fully customized solutions and is recognized as the largest provider in this area based on 2024 revenue according to Frost & Sullivan.
ESWIN has raised a total of $2.429 billion across 8 funding rounds, with this Series D being the latest noted at $421.86 million on June 16, 2023. The firm operates in the semiconductor space, particularly in computing solutions amid China's push for domestic chip technologies.
For 2023, coinciding with the round timing, ESWIN reported revenue of $207.63 million, providing a key traction metric near the funding date. The company continues to position itself strongly in RISC-V customization, with leadership from industry veterans in semiconductor display and computing.
May-23
Series C
Phase II F…Phase II Fund
$329M
$2.9B
Xi’an ESWIN Material Technology Co., Ltd. is a leading Chinese producer of 12-in…Xi’an ESWIN Material Technology Co., Ltd. is a leading Chinese producer of 12-inch silicon wafers for semiconductors, ranking as China's largest and the world's sixth-largest by shipments and capacity. Founded in 2016, it supplies key clients including SMIC, Hua Hong, UMC, GlobalFoundries, and Powerchip, focusing on mature chip processes. The company emphasizes localization of raw materials and equipment amid geopolitical risks, with significant R&D investment totaling RMB 576 million from 2022 to 2024 and 539 invention patents by end-2024.
The company reported operating revenue of RMB 1.47 billion in 2023, increasing 43.9% to RMB 2.12 billion in 2024, yet incurred net losses including RMB 737.6 million in 2024. It qualified for STAR Market listing under standards requiring expected market value of at least RMB 3 billion and recent year revenue of RMB 300 million.
In 2024-2025, Xi’an ESWIN advanced toward IPO on Shanghai's STAR Market, receiving approval from the SSE Listing Review Committee on August 14, 2025, and debuting successfully with shares surging 198.7% to a RMB 104 billion ($14.6 billion) market cap after raising RMB 4.6-4.9 billion for Phase II of its Xi'an Silicon Industry Base. This marked the largest STAR IPO of 2024 and the first for a pre-profit firm under June 2024 reforms promoting 'hard tech' in semiconductors. By end-2024, it held about 7% of global 12-inch wafer capacity, projecting growth to over 10% by 2026 alongside China's rising share.
Dec-22
Series C
Beijing Fi…+10Beijing Financial Street Investment (Group); China Development Bank Capital; Shang Qi Capital; SDIC Unity Capital; Hongsheng Capital; Zhongji Investment; GF Venture Capital; China Life Investment Holding; Source Code Capital; China National Building Material; Chongqing Yufu Holding Group
$574M
$4.6B
Xi’an ESWIN Material Technology Co., Ltd. is a leading Chinese producer of 12-in…Xi’an ESWIN Material Technology Co., Ltd. is a leading Chinese producer of 12-inch silicon wafers for semiconductors, ranking as China's largest and the world's sixth-largest by shipments and capacity. Founded in 2016, the company focuses on research, production, and sales of polished single-crystal silicon wafers and epitaxial wafers, along with polishing pads and after-sales services. It operates in the semiconductor materials sector, supporting integrated circuit manufacturing amid China's push for domestic chip supply chain independence.
In 2022, around the time of the specified VC funding round involving investors like China National Building Material as lead, Beijing Financial Street Investment, and others, Xi’an ESWIN reported operating revenue of RMB 1.055 billion, up from prior years, with a compound annual growth rate reaching 41.83% by 2024. The company also recorded a net loss of 416 million yuan in 2022, reflecting heavy investments in scaling production.
The firm continued aggressive expansion, with cumulative R&D investment of RMB 576 million from 2022 to 2024 and revenue growing to RMB 2.121 billion in 2024. By end-2024, it employed 235 R&D staff (12% of workforce) and held 539 invention patents, qualifying under STAR Market sci-tech criteria. In October 2025, it debuted on Shanghai’s STAR Market as the first unprofitable listing under reforms, raising 4.6 billion yuan at a 104 billion yuan ($14.6 billion) market cap, though still reporting losses with 2024 revenue of 2.1 billion yuan.
Post-IPO metrics as of late 2025 show trailing twelve-month revenue of CN¥2.12 billion, negative gross profit of CN¥129.61 million, and net earnings of -CN¥737.64 million, with a market cap of CN¥112.13 billion and enterprise value/revenue multiple of 54.9x. These later figures highlight ongoing unprofitability but rapid revenue scaling in a competitive wafer market.
Dec-21
Series C
SAIC Capit…+7SAIC Capital; China Development Bank Capital; GoldStone Investment; IDG Capital; InnoVision Capital; Liu Yiqian; China Internet Investment Fund; Legend Capital
$393M
$5.1B
Beijing Eswin Technology Group, also known as ESWIN Computing, is a China-based…Beijing Eswin Technology Group, also known as ESWIN Computing, is a China-based semiconductor technology developer founded in 2016, specializing in integrated chips for artificial intelligence-powered applications including data processing, wireless connectivity, displays, video, and intelligent solutions. It also provides silicon materials, advanced packaging products, and packaging/testing services.
In December 2021, the company completed a RMB 2.5 billion ($392 million) Series C funding round co-led by Goldstone Investment (Jinshi) and China Internet Investment Fund, with participation from SAIF Capital (SAIC Capital), China Development Bank Capital, IDG Capital, Legend Capital, InnoVision Capital, and private investor Liu Yiqian. This Series C followed a $282 million Series B in June 2020 led by Legend Capital and a Series A in January 2019 led by IDG Capital.
Sources describe ESWIN as a unicorn with a valuation of 35 billion (likely CNY), reflecting strong market positioning in China's semiconductor sector amid chip shortages and heightened investor interest post-pandemic. The semiconductors and chips space saw increased corporate venture activity, with deal values nearly doubling from $2.05 billion in 2020 to $3.88 billion by late 2021, indicating upward pressure on valuations. In 2021, ESWIN delivered China's first 32-bit RISC-V master processing chip, underscoring technological progress.
Jul-21
Series B
Core Energ…+8Core Energy Investment; GoldStone Investment; Jinshi Investment; Triniti Capital; ZWC Partners; Gage Finance; Yida China Holdings; China Internet Investment Fund; Forebright Capital
$463M
-
Xi’an ESWIN Material Technology Co., Ltd. is China’s largest and the world’s six…Xi’an ESWIN Material Technology Co., Ltd. is China’s largest and the world’s sixth-largest producer of 12-inch silicon wafers, specializing in research, production, and sales of semiconductor wafers. Founded in 2016, the company focuses on high-end silicon wafer technology and has built significant production capacity, ranking among leading domestic manufacturers based on 2024 shipments and capacity. It debuted on Shanghai’s STAR Market in October 2025 as the first unprofitable company under new reforms, surging 198.7% on day one to a 104 billion yuan market cap after raising 4.6 billion yuan in its IPO, the largest STAR IPO of 2024.
The company reported operating revenue of 1.055 billion CNY in 2022, increasing to 2.121 billion CNY in 2024 with a compound annual growth rate of 41.83%, though it remained unprofitable with a 2022 net loss of 416 million yuan.
ESWIN has invested heavily in R&D, spending 576 million CNY cumulatively from 2022-2024, employing 235 R&D staff (12% of workforce) and holding 539 invention patents by end-2024. Its IPO proceeds funded Phase II of the Xi'an ESWIN Silicon Industry Base. The prospectus qualified it under STAR Market’s fourth listing standard: expected market value over 3 billion RMB and recent year revenue over 300 million RMB. Post-IPO market cap reached 104 billion yuan ($14.6 billion USD).
Beijing Eswin Computing Technology (ESWIN Computing) is a Chinese semiconductor…Beijing Eswin Computing Technology (ESWIN Computing) is a Chinese semiconductor startup founded around 2016 that develops integrated chips and solutions focused on displays and videos, AI data processing, wireless connectivity, advanced packaging, and testing.
The company raised $283 million in its Series B funding round on June 9, 2020, led by Legend Capital (Lenovo's investment arm) and IDG Capital, with participation from Riverhead Capital Investment Management, Lighthouse Capital, and state-backed investors from Haining City and Zhejiang Province including Haining Industrial Investment Group and Haining Juanhu Dream Technology Fund. The funding aims to expand research and development, manufacturing capabilities, and recruitment to reduce China's reliance on U.S. and U.K. chip suppliers amid U.S.-China trade tensions, including the Huawei blacklist.
ESWIN is led by Wang Dongsheng, former chairman of BOE Technology Group, a major Chinese display manufacturer serving clients like Huawei. BOE holds a 37.35% stake in ESWIN's chip-related business, maintaining an ongoing relationship. By later stages, ESWIN had raised a total of 9 billion yuan across four financing rounds since inception, positioning it as a key player in China's domestic semiconductor push. A prospectus later described it as a unicorn valued at 35 billion yuan (approximately $5 billion USD at the time). The company operates in a competitive landscape driven by national semiconductor self-sufficiency goals, leveraging ties to BOE and state investors.
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